Archive for the ‘Silicon’ Category

Software defined silicon nears reality

Monday, February 25th, 2008

Innovative multiprocessor approach to configurable semiconductor devices brings a new level of flexibility and low cost to a broad range of consumer applications XMOS Semiconductor has created working silicon and beta design tools for its Software Defined Silicon (SDS), a new class of programmable semiconductor. Test chips were produced by TSMC ...

Silicon-on-sapphire pressure transducer technology

Monday, February 25th, 2008

Resistive pressure measurement has taken the lead as the most popular sensing technique in the manufacture of pressure sensors: this article explains the development of silicon-on-sapphire technology The applied pressure causes the deformation of a diaphragm. This deformation is translated into a proportional electrical signal by means of a strain gauge ...

Demodulator and silicon tuner come together

Monday, February 25th, 2008

Chip combines Legend's innovative digital TV demodulator technology, which is at the core of GB20600-2006, and Analog Devices silicon tuner technology Legend Silicon has released a single-chip device for the China digital television Terrestrial Broadcasting (DTTB) System Standard (GB20600-2006). The chip combines Legend's innovative digital TV demodulator technology, which is at ...

Accelerometer has MEMS silicon capacitive sensors

Monday, February 25th, 2008

The CTA001 accelerometer from Celsum Technologies uses MEMS technology, micro-machined silicon capacitive sensors, and is available with ranges from +/-2g to +/-225g The CTA001 accelerometer from Celsum Technologies uses MEMS technology, micro-machined silicon capacitive sensors at the heart of a low cost but high performance sensor. With ranges available from +/-2g ...

Silicon Imaging camera range come to the UK

Monday, February 25th, 2008

These cameras use Cmos technology, USB communications, are compact and include standard C-mount interface for easy attachment to microscopes Kane Computing has a new distribution agreement with Silicon Imaging to sell its range of cameras in the UK. In addition Deltapix, a long standing partner of KCL, has launched a new ...

Silicon cuts Timminco’s Q3 loss by 47%; closing part of Mg plant

Tuesday, December 5th, 2006

Toronto-based Timminco reported Wednesday that increased third quarter silicon group revenues helped cut its Q3 net loss to C$3.1 million ($2.75 million) compared with a net loss of C$5.8 million in Q3 2005, a 47% loss reduction. It also announced it will close part of its Haley Ontario magnesium operation. Company sales ...

Stents – Demonstration of Surface Analysis Techniques to Analyse Problems Associated with Stents

Thursday, April 6th, 2006

Background Surface technologies play an important role in accelerating the development of pharmaceutical products and in the optimisation of manufacturing processes so that ‘pipeline’ products reach the market place quickly. Critical interactions continually take place between surfaces of product, plant and packaging throughout the manufacturing process and indeed the entire pharmaceutical product ...

Starfire Systems Begin Work on Ceramic Brakes

Thursday, April 6th, 2006

Starfire Systems have begun work on a two year project to develop ceramic brake materials for sports utility vehicles and light trucks. The project received $150,000 of funding from the New York State Energy Research and Development Authority. They intend to bring the technology which has only been the realm of ...

Sputter Deposition of Thin Films – Services by Advanced Research Corporation

Thursday, April 6th, 2006

Background Sputtering is a method of depositing thin materials on a variety of substrates.  Using radio frequency (RF) power to drive the deposition, both metals and dielectric materials can be grown. The Sputter Coating Process In sputtering, an inert gas is ionized in an electric field.  These ions are ...

Spark Plasma Sintering – A Method for Toughening Ceramics

Thursday, April 6th, 2006

Background Silicon nitride ceramics are widely used in structural applications because they have low density yet are very tough. Their damage tolerance is based upon an interlocking microstructure of elongated grains, which is developed by heating the appropriate powder compacts to temperatures above 1,700°C for extended periods, at which point densification, ...